Electronic components are the important part of military electronics products, whose quality will directly affect the quality of various types of equipment and has a great impact on the reliability of the products. Sealing performance is an important index of the quality of the sealed electronic components. The application and practice of the seal test method of the Destructive Physical Analysis(DPA) for electronic components are introduced in this paper. The problems which should be paid attention to and the countermeasures in the fine leak detection and crude leak test are concluded.