The structure of flip chip assembly integrated circuit is different from conventional packaging, which brings that the current unsealing technology is not completely suitable for flip chip assembly integrated circuit. After analyzing the structures of flip chip assembly integrated circuits with different packaging forms, key factors which restrict the present unsealing technology can be found out. Taking ceramic and plastic sealed packaging flip chip assembly integrated circuits as examples, applying methods such as the heat gun, pretreatment under high temperature, mechanical stress and chemical corrosion, a set of comprehensive flip chip assembly integrated circuit unsealing technology with strong applicability and high efficiency is put forward. In addition, living examples are used for validation and conclusion. This technology can effectively solve the unsealing problem of flip chip assembly integrated circuit and provide basis and help for the subsequent revision of the standard and the destructive physical analysis.