Under the modern high density integration design standard, field-circuit cooperated analysis method with the efficient and accurate Electro-Magnetic Compatibility(EMC) analysis ability, is widely applied in the System in Package(SiP) technology design. Based on the theory of network scattering parameters, equivalent model for field-circuit cooperated analysis method is built. After theoretical analysis for its working principle, the radio frequency surface mount amplifier layout is taken as an example to verify the model’s accuracy by means of Matlab theoretical calculation and model simulation. And then the EMC issues of the high power Radio Frequency(RF) devices integration are investigated. It is found that the electromagnetic coupling can be reduced through changing itself factors of interconnection structure, for example, changing the length, shape, distance, or changing external factors, such as adjusting the cavity resonance, the position of the interconnection. As a result, the EMC issues, like strong coupling, self excitation, can be avoided, and the performance of the system is improved greatly.