A four-channel X-band chip transceiver System in a Package(SiP) module was realized by integrating multiple Monolithic Microwave Integrated Circuits(MMICs) and passive power division network into a very compact volume using silicon-based 3D heterogeneous integration technology. The module is Package on Package(PoP) stacked by two silicon-based packages, and the different packages are interconnected through the Ball Grid Array(BGA) mode. Chips are installed on the upper and lower surfaces of the inner cavity of a single package. The internal package is vertically interconnected using Through Silicon Via(TSV) and the module dimensions are 14 mm×14 mm×3.2 mm. The test results show that within 8~12 GHz, the transmission saturation output power of the module is ≥30.5 dBm, the receiving gain is ≥24.5 dB, the noise figure is ≤3 dB, the receiving input P_-1 is ≥-26 dBm, and it also features 6-bit digital phase shifting and 6-bit digital attenuation capabilities, weighs approximately 1 g. It can be widely used in microwave transceiver system.