Power bus noise problem and Electromagnetic interference(EMI) problem caused by resonant impedance had become a major concern for Electromagnetic Compatibility(EMC) engineers engaged in Printed Circuit Board(PCB) design. Previous research had shown that proper Electromagnetic Band-Gap(EBG) structure could reduce not only the magnitude of the transfer impedances but also the number of the resonance peaks, thus contributed to the EMI reduction of the power bus. In this paper, we had focused on the EMI problem from the power bus structure using such EBG structures and found that using the magnetic material coating on the power and ground planes could significantly contribute to the EMI reduction.