The new process of laser technology combined with manual and automatic acid decapsulation is applied to decapsulation experiment of small, heteromorphic and multichip plastic encapsulated microcircuits. The laser etches the encapsulation materials above the chip accurately and incompletly, and then combines with manual and automatic acid decapsulation to remove the rest encapsulation material on the chip surface. The experimental results show that the manual and automatic acid decapsulation time is 8 s after laser decapsulation. Comparing with the traditional acid decapsulation, the laser technology in decapsulation of plastic encapsulated microcircuits can achieve accurate positioning, shortening the time of decapsulation, and improving the efficiency.