The relationship between temperature drift and adhesive is investigated, based on the finite element approach and principle of servo feedback sandwich accelerometer, to cope with the temperature drift of sandwich type accelerometer. It is found that the temperature drift is changed with the changes of thickness, Young’s modulus of adhesive and the thickness of glass. When the thickness of adhesive increases from 15 μm to 35 μm, the temperature drift decreases by about 25%. When the modulus of adhesive varies from 4 GPa to 0.25 GPa, the temperature drift decreases by about 25%. When the thickness of glass adjacent to adhesive increases from 400 μm to 1 000 μm, the temperature drift decreases by about 37%. Meanwhile, it is indicated, by the comparison between the experiment data and the drift brought by the adhesive, that the temperature drift induced by the adhesive is about 1/4 to 1/3 of the experiment data. The exploration might be helpful for the understanding of relationship between temperature drift and adhesive of sandwich type micro-accelerometers.